JPH0644116Y2 - 炭化ケイ素発光ダイオード装置 - Google Patents

炭化ケイ素発光ダイオード装置

Info

Publication number
JPH0644116Y2
JPH0644116Y2 JP1988089180U JP8918088U JPH0644116Y2 JP H0644116 Y2 JPH0644116 Y2 JP H0644116Y2 JP 1988089180 U JP1988089180 U JP 1988089180U JP 8918088 U JP8918088 U JP 8918088U JP H0644116 Y2 JPH0644116 Y2 JP H0644116Y2
Authority
JP
Japan
Prior art keywords
type
emitting diode
light emitting
light
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988089180U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0211360U (en]
Inventor
潔 太田
好晴 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1988089180U priority Critical patent/JPH0644116Y2/ja
Publication of JPH0211360U publication Critical patent/JPH0211360U/ja
Application granted granted Critical
Publication of JPH0644116Y2 publication Critical patent/JPH0644116Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1988089180U 1988-07-05 1988-07-05 炭化ケイ素発光ダイオード装置 Expired - Lifetime JPH0644116Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988089180U JPH0644116Y2 (ja) 1988-07-05 1988-07-05 炭化ケイ素発光ダイオード装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988089180U JPH0644116Y2 (ja) 1988-07-05 1988-07-05 炭化ケイ素発光ダイオード装置

Publications (2)

Publication Number Publication Date
JPH0211360U JPH0211360U (en]) 1990-01-24
JPH0644116Y2 true JPH0644116Y2 (ja) 1994-11-14

Family

ID=31313734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988089180U Expired - Lifetime JPH0644116Y2 (ja) 1988-07-05 1988-07-05 炭化ケイ素発光ダイオード装置

Country Status (1)

Country Link
JP (1) JPH0644116Y2 (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4905751B2 (ja) * 2001-05-17 2012-03-28 株式会社吉田製作所 歯科用光照射器
EP2023409B8 (en) * 2006-04-28 2018-06-27 Shimane Prefectural Government Semiconductor light emitting module and device and method of manufacturing the same
WO2014196285A1 (ja) * 2013-06-04 2014-12-11 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0211360U (en]) 1990-01-24

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